JPH0127572Y2 - - Google Patents
Info
- Publication number
- JPH0127572Y2 JPH0127572Y2 JP17205984U JP17205984U JPH0127572Y2 JP H0127572 Y2 JPH0127572 Y2 JP H0127572Y2 JP 17205984 U JP17205984 U JP 17205984U JP 17205984 U JP17205984 U JP 17205984U JP H0127572 Y2 JPH0127572 Y2 JP H0127572Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- stranded
- rail
- enlarged
- conductive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005219 brazing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17205984U JPH0127572Y2 (en]) | 1984-11-13 | 1984-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17205984U JPH0127572Y2 (en]) | 1984-11-13 | 1984-11-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6187465U JPS6187465U (en]) | 1986-06-07 |
| JPH0127572Y2 true JPH0127572Y2 (en]) | 1989-08-18 |
Family
ID=30729729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17205984U Expired JPH0127572Y2 (en]) | 1984-11-13 | 1984-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0127572Y2 (en]) |
-
1984
- 1984-11-13 JP JP17205984U patent/JPH0127572Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6187465U (en]) | 1986-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3115155B2 (ja) | 半導体装置およびその製造方法 | |
| JPH0127572Y2 (en]) | ||
| JPH02148795A (ja) | ハイブリッドモジュールのリード接続方法 | |
| KR880013243A (ko) | 금 합금 와이어와 구리 도프 알루미늄 반도체회로 상호접속 결합패드 사이의 전기 접속부 및 이의 제조방법 | |
| JP3081155B2 (ja) | 温度ヒューズおよびその製造方法 | |
| JPH11144832A (ja) | 鉄道レール用電線の接続装置及びその接続方法 | |
| JP2651853B2 (ja) | 電子装置 | |
| JPS6254500A (ja) | ワイヤ接続方法 | |
| JPH02224348A (ja) | 半導体装置 | |
| JP4068239B2 (ja) | 超音波送受波器 | |
| JP3237910B2 (ja) | 可撓性基板の端子構造 | |
| JPS6318139Y2 (en]) | ||
| JPS5935954Y2 (ja) | リ−ド端子 | |
| JPH0331085Y2 (en]) | ||
| JPS6022827B2 (ja) | ボンデイングワイヤ | |
| JPH0524133Y2 (en]) | ||
| JPS58199549A (ja) | 面取り付け構造型電子部品 | |
| JPH06350235A (ja) | 表面実装用プリント配線板のための接続パッド | |
| JPH01297834A (ja) | ワイヤボンデイング方法 | |
| JPS61112500A (ja) | 超音波探触子 | |
| JPS60136101U (ja) | 電子部品の接続装置 | |
| JPH02126695A (ja) | 電子部品のプリント配線板への接続方法 | |
| JPS59180917A (ja) | 接点付導体の製造方法 | |
| JPS60100459A (ja) | 半導体装置用パツケ−ジ | |
| JPS6423127U (en]) |